LPKF - LPKF-LDS | Injection Moulding 3D Process Get latest price

With LPKF’s Laser Direct Structuring process (LDS) it is possible to produce circuit layouts on complex three-dimensional carrier structures. The laser beam structures the layout directly into the molded plastic part. As a result, weight and fitting space can be effectively reduced. Your design teams enjoy complete 3D capability on freeform surfaces and great freedom for redesigns. Thus LPKF-LDS™ opens up new possibilities.

To contact Embedded Logic Solutions about LPKF LPKF-LDS | Injection Moulding 3D Process use Get a quote.

With LPKF’s Laser Direct Structuring process (LDS) it is possible to produce circuit layouts on complex three-dimensional carrier structures. The laser beam structures the layout directly into the molded plastic part. As a result, weight and fitting space can be effectively reduced. Your design teams enjoy complete 3D capability on freeform surfaces and great freedom for redesigns. Thus LPKF-LDS™ opens up new possibilities.

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To contact Embedded Logic Solutions about LPKF LPKF-LDS | Injection Moulding 3D Process use Get a quote.